The domestic semiconductor equipment and materials exhibition CSEAC2026 has come to an end, and localization has shifted from "usable" to "easy to use"

On August 31st, CSEAC2026 China Semiconductor Equipment and Materials Exhibition officially kicked off in Wuxi. The exhibition area of this exhibition has exceeded 70000 square meters, gathering more than 1400 semiconductor upstream and downstream industry chain enterprises to showcase on the same stage. The exhibits cover the entire process of wafer manufacturing, including etching, thin film deposition, quantity testing, core components, semiconductor materials and other key sub links. It is a leading industrial exchange event in the field of semiconductor equipment materials in China.

From the industry signals conveyed by the exhibition, it can be seen that the logic of domestic semiconductor equipment localization is undergoing a profound transformation. Early domestic equipment research focused more on whether samples could be made, completing equipment prototype development, and realizing basic process functions. At this stage, the industry's focus has shifted to two core indicators: yield stability and long-term continuous operation reliability. At the same time, the research and development direction of the industry closely follows the trend of advanced packaging, targeting cutting-edge application scenarios such as HBM high bandwidth memory and Chiplet chip integration, developing specialized process equipment that is compatible with advanced packaging industry chain development.

At the application market level, the penetration boundary of domestic equipment continues to widen. Previously, the landing scenarios of domestic equipment were mainly based on mature process production lines, meeting the manufacturing needs of power devices, storage, and ordinary analog chips; Nowadays, domestic equipment is accelerating its penetration into advanced technology and high computing power AI chip production lines, gradually entering the computing power chip manufacturing supply chain and supporting the construction of domestic AI chip production capacity.

At the same time, the shortcomings in the industrial chain still objectively exist. In the field of high-end lithography equipment, there is still a significant technological gap in China; Key supporting links such as special electronic gases, high-end target materials, and precision core components still lag behind international leading manufacturers in terms of purity, consistency, and long-term supply stability for some categories. Making up for shortcomings in the semiconductor supply chain is not a short-term project, but requires continuous collaborative investment from industry capital, research institutions, and manufacturing enterprises to gradually complete technological iteration and supply chain self-reliance construction.