Shenzhen Zhihuang Technology Co., Ltd. possesses strong production technology capabilities, building a technical system around electronics assembly, precision mounting, soldering processes, packaging integration, and process optimization—enabling us to support customer products from R&D introduction, trial production verification, to mass-production handoff, while helping improve manufacturing precision, process stability, and production efficiency.

Core Production Technology Capabilities:

★ Soldering & mounting technology

★ SMT, supporting BGA, uBGA, PoP, and 01005 components

★ Fine-pitch packaging, supporting BGA/CSP/CBGA/CCGA/PGA with minimum lead pitch down to 140μm

★ COB, PoP, multi-chip packaging, and Chip on FPC

★ Soldering & flip-chip, with chip sizes ranging from 0.5–50mm

★ Process optimization, process validation & production introduction support